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    Can chemical etching with metal be used to engrave a beautiful 4-inch silicon wafer?

    • Björn Agnarsson Björn Agnarsson < / li>

    Judging by the literature data, o The main goal of MACE-based HF / H2O2 studies seems to be to achieve micro-, possibly nanostructures (such as lattices) with rather high first-class aspect ratios and low wall thicknesses. Roughness. … .. and I understand that this is usually a very delicate process that involves optimization of various parameters, for example, due to alkali concentration, temperature, thickness and morphology, catalysts, etc. H2O2 gives the best results depending on the applied whether magnetic direction or not, in addition to the size of the structure being created. In some cases [HF]> [H2O2] seems to be used, while in similar cases [HF] <[H2O2] seems to give the best results.

    But in my case, I just need circular cries across the pillow, where the sidewall roughness as well as the slope are of particular importance.

    My idea:

    1) structure disc-like structures (500 micrometers in diameter) and / or make them circular (with an inner length of 500 x micrometers and an outer width of 500 micrometers, where x can be only 500 to 499 micrometers) using withstandard photosensitive resin (S1813).

    2) evaporation of Ti / Au / Fe / Au (1.5 / 20/10/20 nm) or possibly just Au / Fe / Au (20/10/20 nm).

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    3) Either flake off or not (leave a transparent coating of photosensitive resin with metal layers on top)

    4) Plate in HF / H2O2 solution at specific concentrations around room temperature at night (or by the hour).

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    Sounds doable? What concentrations of HF / H2O2 would be recommended and what metallic pattern might appear during the etching process (d is probably faster at the end than in the middle). Do I need to remove photosensitive resin before engraving? Titanium is also used to increase the adhesion of most Au layers, which is a disease in your opinion.

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    Best regards and try to convey your comments.

    Bjà ¶Dn

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    Can chemical etching with metal be used to etch a 4-inch silicon wafer?

    • Björn Agnarsson Björn Am Agnarsson

    I’m looking for your own way to drill holes in a special silicon wafere (100) 4 inches (525 microns) thick to cover 500 micron holes for microfluidic applications, and I was curious to see if Metal Assisted could be useful for this purpose MACE chemical potentially magnetically guided etching (MACE) can be used in conjunction with etching with HF / H2O2. I am also looking into using deep reactive ion etching for this purpose or perhaps KOH etching on the other hand is a different topic.

    Based on the literature, we see the focus of HF / H2O2 in MACE studies based on microphone extraction – or nanostructures (like gratings) with relatively high proportions and little wall roughness, etc., and understand, that this value is most likely a delicate process of optimizing various parameters such as etching agent concentration, temperature, thickness, thickness, catalyst morphology, etc. This depends on the amount of HF and H2O2 that gives the best results, depending on whether long-term recommendations, solely on the dimensions of the structure to be obtained. [HF]> [H2O2],seems to be used for some conditions, while in other cases [HF] <[H2O2] seems to give the best results.

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    But in my personal case, I need circulars with more or less holes in the insert if the roughness and slope of the side walls are important.

    My idea:

    1) structure disc-like structures (about 500 micrometers) that are part of the diameter) and / or circular structures (with an inner diameter of 500 -x micrometers and an outer diameter of 500 micrometers, where x can range from 500 to 499 micrometers) using a conventional photosensitive resin (S1813).

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    2) Ti / Au / Fe / Au (1.5 / 20/10/20 nm) for single evaporation of Au / Fe / Au (20/10/20 nm).

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    3) Remove the plate or not (leave the photosensitive resin with metal layers on it)

    4) Place the plate in the HF / H2O2 solution in the specified amounts at room temperature. for a day (or for several hours).

    Does this seem easy to you? What HF ​​/ H2O2 concentrations would you recommend and what metal pattern is likely to start after etching (d will probably be faster than all centers). Should you leave Photoresit on the item or remove it before incineration? Titanium is used to increase adhesion to the Au layer, in your opinion this is a real problem.

    Best regards and I look forward to your input.

    Bjö dn

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